Binatone e900 System Spezifikationen Seite 63

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System expansio ns
Installing and removing low-prole boards (device-dependent)
Low-proleboar d
For e very slot there is a slot co ver provided. If no board is installed, the slot c over protects the slot.
When you insta ll a board, do not discard the corresponding slot cover.
For cooling, protection against re and in order to comply with EMC regulations,
you must ret the slot cover if you remove the board.
Opening the board retaining mechanism
Remove the casing cover (
see Chapter "
Removing the casing cover", Page 37).
1
Fold out the bo
ard retaining mechanism (1).
Fujitsu 59
Seitenansicht 62
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